The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2022

Filed:

Oct. 02, 2020
Applicant:

Japan Aviation Electronics Industry, Limited, Tokyo, JP;

Inventors:

Yukitaka Tanaka, Tokyo, JP;

Yuki Suda, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/00 (2006.01); H01R 13/6582 (2011.01); H01B 7/08 (2006.01); H01R 12/79 (2011.01); H01R 12/77 (2011.01); H01R 12/59 (2011.01);
U.S. Cl.
CPC ...
H01B 7/0045 (2013.01); H01B 7/0869 (2013.01); H01R 12/594 (2013.01); H01R 12/775 (2013.01); H01R 12/79 (2013.01); H01R 13/6582 (2013.01); H01R 12/59 (2013.01);
Abstract

A connecting object is used for connection to a device. The connecting object has a sheet-like shape. The device has at least two ground pins and at least one signal pin. The at least one signal pin is arranged between two of the ground pins in a pitch direction. The connecting object has a wiring layer, a shield layer and an insulator. The wiring layer is formed with only a signal line which is configured to be connected with the signal pin. The wiring layer is formed with no ground line which is configured to be connected with the ground pin. The shield layer covers the wiring layer via the insulator which is positioned between the shield layer and the wiring layer.


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