The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2022

Filed:

Mar. 15, 2018
Applicant:

Asahi Kasei Kabushiki Kaisha, Tokyo, JP;

Inventors:

Eiichi Ohno, Tokyo, JP;

Toru Yumoto, Tokyo, JP;

Masanori Tsuruta, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H01B 1/22 (2006.01); H01B 13/008 (2006.01); H05K 3/12 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); H01B 13/008 (2013.01); H05K 1/09 (2013.01); H05K 1/092 (2013.01); H05K 3/1291 (2013.01); H05K 2203/0117 (2013.01);
Abstract

A conductive pattern having high dispersion stability and a low resistance over a board is formed. A dispersing element () contains a copper oxide (), a dispersing agent (), and a reductant. Content of the reductant is in a range of a following formula (1). Content of the dispersing agent is in a range of a following formula (2).0.0001≤(reductant mass/copper oxide mass)≤0.10  (1)0.0050≤(dispersing agent mass/copper oxide mass)≤0.30  (2)The dispersing element containing the reductant promotes reduction of copper oxide to copper in firing and promotes sintering of the copper.


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