The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2022

Filed:

Mar. 05, 2020
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Bing-Cheng Hsu, Changhua County, TW;

Cheng-Kai Huang, Taichung, TW;

Jan-Hao Chen, Changhua County, TW;

Chwen-Yi Yang, Hualien County, TW;

Yi-Ying Lin, Taichung, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06T 7/00 (2017.01); G06T 7/149 (2017.01); G06T 7/11 (2017.01); A43D 1/08 (2006.01); A41H 3/00 (2006.01); B25J 18/00 (2006.01); G05B 19/418 (2006.01);
U.S. Cl.
CPC ...
G06T 7/0004 (2013.01); A41H 3/007 (2013.01); A43D 1/08 (2013.01); B25J 18/00 (2013.01); G05B 19/41885 (2013.01); G06T 7/11 (2017.01); G06T 7/149 (2017.01); A43D 2200/10 (2013.01);
Abstract

A system for establishing a junction trace of an assembly includes a surface model creating module, a processing module, and a material inspection module. The assembly includes a first part and a second part assembled with each other. The surface model creating module scans the first part and the second part to separately establish first surface model data and second surface model data. The processing module establishes assembled surface model data according to the first surface model data and the second surface model data, determines a junction region from the assembled surface model data, and determines inspection points mapped on the assembly according to the junction region. The material inspection module inspects materials of the assembly at the inspection points. The processing module establishes a junction trace of the first part and the second part in the assembly according to a material inspection result.


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