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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11269254 B1

PDFFull Text
Date of Patent:
Mar. 08, 2022

Filed:

Aug. 10, 2016

Production method for antenna substrate, production method for antenna substrate with wiring line and electrode, and production method for rfid element

Applicant:

Toray Industries, Inc., Tokyo, JP;

Inventors:

Junji Wakita, Otsu, JP;

Hiroji Shimizu, Otsu, JP;

Seiichiro Murase, Otsu, JP;

Assignee:

TORAY INDUSTRIES, INC., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Peter Dungba Vo

Assistant Examiner:

Azm A Parvez

Int. Cl.
CPC ...
G03F 7/00 (2006.01); G03F 7/031 (2006.01); H01L 29/786 (2006.01); H01L 51/05 (2006.01); H05K 1/09 (2006.01); H01P 11/00 (2006.01); H05K 1/16 (2006.01); G06K 19/077 (2006.01); G03F 7/004 (2006.01); G03F 7/038 (2006.01); G03F 7/09 (2006.01); G03F 7/095 (2006.01); G03F 7/16 (2006.01); G03F 7/20 (2006.01); G03F 7/32 (2006.01); H01L 21/48 (2006.01); H01L 23/66 (2006.01); H01Q 1/38 (2006.01); G03F 7/027 (2006.01); B82Y 30/00 (2011.01); B82Y 40/00 (2011.01); H01L 51/00 (2006.01); H01Q 1/22 (2006.01); H01Q 7/00 (2006.01);
U.S. Cl.
CPC ...
G03F 7/031 (2013.01); G03F 7/0035 (2013.01); G03F 7/0045 (2013.01); G03F 7/0047 (2013.01); G03F 7/0388 (2013.01); G03F 7/094 (2013.01); G03F 7/095 (2013.01); G03F 7/16 (2013.01); G03F 7/168 (2013.01); G03F 7/2002 (2013.01); G03F 7/2022 (2013.01); G03F 7/322 (2013.01); G06K 19/077 (2013.01); G06K 19/07722 (2013.01); H01L 21/4853 (2013.01); H01L 21/4867 (2013.01); H01L 23/66 (2013.01); H01L 29/786 (2013.01); H01L 51/05 (2013.01); H01P 11/00 (2013.01); H01Q 1/38 (2013.01); H05K 1/09 (2013.01); H05K 1/16 (2013.01); B82Y 30/00 (2013.01); B82Y 40/00 (2013.01); G03F 7/027 (2013.01); H01L 51/0036 (2013.01); H01L 51/0043 (2013.01); H01L 51/0048 (2013.01); H01L 2223/6677 (2013.01); H01Q 1/2208 (2013.01); H01Q 7/00 (2013.01); Y10S 977/742 (2013.01); Y10S 977/842 (2013.01); Y10S 977/954 (2013.01);
Abstract

An object of the present invention is to provide a method for accurately forming an antenna substrate as well as an antenna substrate with wiring line and electrode by a coating method. One aspect of the present invention provides a method for producing an antenna substrate with wiring line and electrode including the steps of: (1) forming a coating film using a photosensitive paste containing a conductive material and a photosensitive organic component on an insulating substrate; (2-A) processing the coating film into a pattern corresponding to an antenna by photolithography; (2-B) processing the coating film into a pattern corresponding to a wiring line; (2-C) processing the coating film into a pattern corresponding to an electrode; (3-A) curing the pattern corresponding to an antenna into an antenna; (3-B) curing the pattern corresponding to a wiring line into a wiring line; and (3-C) curing the pattern corresponding to an electrode into an electrode.

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