The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2022

Filed:

Jul. 27, 2020
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Kwang Oh Kim, Cerritos, CA (US);

Yibing Michelle Wang, Temple City, CA (US);

Radwanul Hasan Siddique, Pasadena, CA (US);

Lilong Shi, Pasadena, CA (US);

Chunji Wang, Pasadena, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01S 17/08 (2006.01); G01S 17/894 (2020.01); G06T 7/55 (2017.01); G06T 7/521 (2017.01); H04N 13/156 (2018.01); H04N 13/254 (2018.01); H04N 5/369 (2011.01); G06K 9/00 (2022.01); G06T 7/20 (2017.01); G05D 1/00 (2006.01); G05D 1/02 (2020.01);
U.S. Cl.
CPC ...
G01S 17/894 (2020.01); G06K 9/00201 (2013.01); G06T 7/20 (2013.01); G06T 7/521 (2017.01); G06T 7/55 (2017.01); H04N 5/36965 (2018.08); H04N 5/379 (2018.08); H04N 13/156 (2018.05); H04N 13/254 (2018.05); G05D 1/0088 (2013.01); G05D 1/0246 (2013.01); G06T 2207/10028 (2013.01); G06T 2207/30252 (2013.01);
Abstract

Provided is a 3D depth sensing system and method of providing an image based on a hybrid sensing array. The 3D sensing system including a light source configured to emit light, a hybrid sensing array comprising a 2D sensing region configured to detect ambient light reflected from an object and a 3D depth sensing region configured to detect the light emitted by the light source and reflected from the object, a metalens on the hybrid sensing array, the metalens being configured to direct the ambient light reflected from the object towards the 2D sensing region, and to direct the light emitted by the light source and reflected from the object towards the 3D depth sensing region, and a processing circuit configured to combine 2D image information provided by the 2D sensing region and 3D information provided by the 3D depth sensing region to generate a combined 3D image.


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