The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2022
Filed:
Jan. 09, 2018
Sensor Networks, Inc., Boalsburg, PA (US);
James Barshinger, State College, PA (US);
Mark Feydo, Reedsville, PA (US);
Jeffrey Anderson, Lewistown, PA (US);
SENSOR NETWORKS, INC., State College, PA (US);
Abstract
A sensor for ultrasonically measuring a portion of a structure having a temperature significantly above room-temperature, the sensor comprising: a high-temperature portion for intimate contact with the structure, the high-temperature portion comprising at least: at least one transducer for converting a first signal to an ultrasonic transmit signal, and for converting an ultrasonic reflected signal to a second signal; a low-temperature portion comprising at least: at least one digital sensor interface (DSI) to which the transducer is electrically connected, the DSI being configured to transmit the first electrical signal and receive the second electrical signal, and to generate an A-scan signal based on the first and second electrical signals; a wireless interface for transmitting a digital signal based directly or indirectly on at least said A-scan signal; and a battery for powering the DSI and the wireless interface; and an elongated member containing one or more electrical conductors for conducting the first and second signals between the transducer and the DSI, the elongated member being configured to offset the low-temperature portion a sufficient distance away from the high-temperature portion such that the low-temperature portion is subjected to significantly less heat from the structure compared to the high-temperature portion.