The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2022
Filed:
Aug. 06, 2018
Applicant:
Hitachi Automotive Systems, Ltd., Hitachinaka, JP;
Inventors:
Norio Ishitsuka, Tokyo, JP;
Yasuo Onose, Hitachinaka, JP;
Assignee:
Hitachi Astemo, Ltd., Hitachinaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01F 1/692 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
G01F 1/692 (2013.01); B81B 7/0006 (2013.01); B81B 2201/0214 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0315 (2013.01); B81B 2207/07 (2013.01);
Abstract
Provided are a semiconductor device and a thermal type fluid flow rate sensor which suppress strain occurring in an aluminum film and suppresses disconnection due to repeated metal fatigue of the aluminum film. The semiconductor device and the thermal type fluid flow rate sensor of the present invention are configured so that the heights of a silicon film and an aluminum film satisfy D>Dbetween a flow rate sensor part (immediately above a diaphragm end part) D and a circuit part (LSI part) D