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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11268214 B1

PDFFull Text
Date of Patent:
Mar. 08, 2022

Filed:

Oct. 20, 2017

Filament for material extrusion 3d printer molding and production method of molded body

Applicants:

Mcpp Innovation Llc, Chiyoda-ku, JP;

Mitsubishi Chemical Corporation, Chiyoda-ku, JP;

Inventors:

Jiro Sano, Mie, JP;

Toshihisa Ishihara, Mie, JP;

Shigeyuki Furomoto, Tokyo, JP;

Assignees:

MCPP Innovation LLC, Chiyoda-ku, JP;

Mitsubishi Chemical Corporation, Chiyoda-ku, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Robert T Butcher

Int. Cl.
CPC ...
D01F 6/56 (2006.01); D01F 6/42 (2006.01); C08L 53/02 (2006.01); C08K 5/01 (2006.01); C08L 23/02 (2006.01); C08L 91/00 (2006.01); B29C 64/118 (2017.01); C08L 23/14 (2006.01); D01F 6/46 (2006.01); B33Y 70/00 (2020.01); B29K 9/06 (2006.01); B29K 23/00 (2006.01); B29K 96/04 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
D01F 6/56 (2013.01); B29C 64/118 (2017.08); C08K 5/01 (2013.01); C08L 23/02 (2013.01); C08L 23/14 (2013.01); C08L 53/02 (2013.01); C08L 53/025 (2013.01); C08L 91/00 (2013.01); D01F 6/42 (2013.01); D01F 6/46 (2013.01); B29K 2009/06 (2013.01); B29K 2023/12 (2013.01); B29K 2096/04 (2013.01); B29K 2105/0085 (2013.01); B29K 2105/0094 (2013.01); B29K 2995/007 (2013.01); B33Y 70/00 (2014.12); C08L 2203/12 (2013.01);
Abstract

The present invention provides a filament for material extrusion 3D printer molding, which affords a molded article having soft texture and excellent heat resistance and among others, exhibits good moldability in molding by a material extrusion 3D printer. The present invention relates to a filament for material extrusion 3D printer molding, including a thermoplastic elastomer which contains at least a specific block copolymer and in which the ratio between storage modulus and loss modulus measured at 200° C. and 100 Hz by dynamic viscoelasticity measurement is in a specific range.

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