The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2022

Filed:

Mar. 24, 2020
Applicant:

Yazaki Corporation, Tokyo, JP;

Inventors:

Yutaka Handa, Shizuoka, JP;

Hiroki Kondo, Shizuoka, JP;

Satoko Hongo, Shizuoka, JP;

Yusuke Yoshikawa, Shizuoka, JP;

Assignee:

YAZAKI CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C 18/16 (2006.01); B32B 9/04 (2006.01); C23C 18/14 (2006.01); B32B 9/00 (2006.01); C23C 18/32 (2006.01); B32B 15/04 (2006.01); C23C 18/40 (2006.01); C23C 18/18 (2006.01);
U.S. Cl.
CPC ...
C23C 18/1639 (2013.01); B32B 9/007 (2013.01); B32B 9/041 (2013.01); C23C 18/14 (2013.01); C23C 18/1651 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 2262/106 (2013.01); B32B 2307/202 (2013.01); B32B 2311/04 (2013.01); B32B 2311/06 (2013.01); B32B 2311/08 (2013.01); B32B 2311/09 (2013.01); B32B 2311/12 (2013.01); B32B 2311/22 (2013.01); C23C 18/1671 (2013.01); C23C 18/1685 (2013.01); C23C 18/1889 (2013.01); C23C 18/32 (2013.01); C23C 18/405 (2013.01); Y10T 428/12861 (2015.01); Y10T 428/30 (2015.01);
Abstract

A metal-plated carbon material includes: a carbon material; and a metal layer covering a surface of the carbon material, in which, in the metal layer, crystal grains forming the metal layer have an average crystal grain size of 110 nm or less. A method of manufacturing a metal-plated carbon material, includes: a metal complex fixation step of immersing a carbon material in a supercritical fluid or subcritical fluid containing an organometallic complex of a first metal; and a first energization deposition step of energizing the metal-complex-fixed carbon material in an electroless plating solution containing a second metal.


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