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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11268004 B1

PDFFull Text
Date of Patent:
Mar. 08, 2022

Filed:

Aug. 31, 2017

Boron nitride aggregated grain

Applicant:

Denka Company Limited, Tokyo, JP;

Inventors:

Go Takeda, Omuta, JP;

Yoshitaka Taniguchi, Omuta, JP;

Assignee:

DENKA COMPANY LIMITED, Tokyo, JP;

Attorney:

Manabu Kanesaka

Primary Examiner:

Hannah J Pak

Int. Cl.
CPC ...
C08K 3/38 (2006.01); C08K 9/02 (2006.01); C09K 5/14 (2006.01); C01B 21/064 (2006.01); C08K 9/04 (2006.01); C09C 3/00 (2006.01); C09C 3/04 (2006.01); C09C 3/06 (2006.01); C09C 3/08 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C01B 21/0645 (2013.01); C01B 21/0648 (2013.01); C08K 3/38 (2013.01); C08K 9/02 (2013.01); C08K 9/04 (2013.01); C09C 3/006 (2013.01); C09C 3/041 (2013.01); C09C 3/066 (2013.01); C09C 3/08 (2013.01); C01P 2002/76 (2013.01); C01P 2004/03 (2013.01); C01P 2004/50 (2013.01); C01P 2004/61 (2013.01); C01P 2004/80 (2013.01); C01P 2006/32 (2013.01); C08K 2003/385 (2013.01); C08K 2201/001 (2013.01); C08K 2201/004 (2013.01); C08K 2201/005 (2013.01);
Abstract

A boron nitride powder includes boron nitride aggregated grains that are formed by aggregation of scaly hexagonal boron nitride primary particles, the boron nitride powder having the following characteristic properties (A) to (C): (A) the primary particles of the scaly hexagonal boron nitride have an average long side length of 1.5 μm or more and 3.5 μm or less and a standard deviation of 1.2 μm or less; (B) the boron nitride aggregated grains have a grain strength of 8.0 MPa or more at a cumulative breakdown rate of 63.2% and a grain strength of 4.5 MPa or more at a cumulative breakdown rate of 20.0%; and (C) the boron nitride powder has an average particle diameter of 20 μm or more and 100 μm or less. Also provided are a method for producing the same and a thermally conductive resin composition including the same.

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