The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2022
Filed:
Sep. 03, 2020
Applicant:
Kioxia Corporation, Tokyo, JP;
Inventors:
Hayato Terai, Mie, JP;
Manabu Takakuwa, Tsu, JP;
Assignee:
Kioxia Corporation, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/10 (2006.01); B32B 38/18 (2006.01); B32B 38/00 (2006.01); B23K 20/02 (2006.01); B29C 65/00 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
B32B 38/1858 (2013.01); B23K 20/02 (2013.01); B29C 66/306 (2013.01); B32B 37/10 (2013.01); B32B 38/145 (2013.01); H01L 21/67092 (2013.01); H01L 21/67282 (2013.01); H01L 21/6838 (2013.01); H01L 2924/00 (2013.01);
Abstract
According to one embodiment, there is provided a substrate bonding apparatus including a first suction stage, a second suction stage, and a pressing member. The first suction stage sucks a first substrate. The second suction stage is arranged so as to face the first substrate. The second suction stage sucks the second substrate. The pressing member is capable of deforming the first substrate sucked on the first suction stage so as to be convex toward the second suction stage side. The pressing member has a marking structure on a distal end side.