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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11267187 B1

PDFFull Text
Date of Patent:
Mar. 08, 2022

Filed:

Sep. 22, 2017

Die, manufacturing method therefor, and molded body manufacturing method

Applicant:

Kyoraku Co., Ltd., Kyoto, JP;

Inventors:

Tatsuya Fukuda, Kanagawa, JP;

Yuki Harasawa, Kanagawa, JP;

Ryosuke Oki, Aichi, JP;

Assignee:

KYORAKU CO., LTD., Kyoto, JP;

Attorney:

Maier & Maier, PLLC

Primary Examiner:

Philip C Tucker

Assistant Examiner:

Jimmy R Smith, Jr

Int. Cl.
CPC ...
B29C 51/36 (2006.01); B29C 33/38 (2006.01); B29C 51/02 (2006.01); B29C 51/10 (2006.01); B29C 65/00 (2006.01); B29K 101/12 (2006.01); B29C 51/26 (2006.01); B29C 48/375 (2019.01); B29C 48/07 (2019.01); B29L 7/00 (2006.01); B29C 48/00 (2019.01); B23P 15/24 (2006.01); B29K 105/04 (2006.01); B29C 51/12 (2006.01); B29C 48/475 (2019.01);
U.S. Cl.
CPC ...
B29C 51/36 (2013.01); B29C 33/3842 (2013.01); B29C 51/02 (2013.01); B29C 51/10 (2013.01); B29C 66/727 (2013.01); B23P 15/24 (2013.01); B29C 48/0017 (2019.02); B29C 48/07 (2019.02); B29C 48/388 (2019.02); B29C 48/475 (2019.02); B29C 51/105 (2013.01); B29C 51/12 (2013.01); B29C 51/267 (2013.01); B29C 2791/006 (2013.01); B29K 2101/12 (2013.01); B29K 2105/04 (2013.01); B29K 2995/0015 (2013.01); B29L 2007/002 (2013.01);
Abstract

A mold which can improve an appearance of a molded body is provided. A mold includes a cavity, the mold being capable of subjecting a resin sheet under reduced pressure suction via a plurality of reduced pressure suction holes thereby shaping the resin sheet to follow a shape of an inner surface of the cavity; wherein: the inner surface includes a base surface and a plurality of island-like concave portions provided in the base surface; and a concave portion reduced pressure suction hole index defined by an in-concave reduced pressure suction hole ratio divided by a concave portion area ratio is 0.5 or lower.

Find Patent Forward Citations

Fukuda, Tatsuya. (2022). Die, manufacturing method therefor, and molded body manufacturing method (U.S. Patent No. 11267187). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11267187

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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