The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2022

Filed:

Mar. 09, 2021
Applicant:

The Procter & Gamble Company, Cincinnati, OH (US);

Inventors:

Todd Douglas Lenser, Liberty Township, OH (US);

Urmish Popatlal Dalal, Milford, OH (US);

Uwe Schneider, Cincinnati, OH (US);

Todd Joseph Statt, Kings Mills, OH (US);

Joerg Mueller, Alte Haingasse, DE;

Melanie Acevedo, Springfield Township, OH (US);

Assignee:

The Procter & Gamble Company, Cincinnati, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/00 (2019.01); A61F 13/15 (2006.01); B32B 7/05 (2019.01); A61F 13/49 (2006.01); B29C 55/02 (2006.01); B29C 65/74 (2006.01); B29C 65/00 (2006.01); B32B 5/02 (2006.01); B32B 37/10 (2006.01); B32B 37/14 (2006.01); B32B 38/00 (2006.01); B29C 65/08 (2006.01); B32B 27/12 (2006.01); B32B 15/09 (2006.01); B32B 27/30 (2006.01); B29C 65/78 (2006.01); B32B 7/04 (2019.01); B32B 27/06 (2006.01); B32B 27/40 (2006.01); B32B 5/22 (2006.01); B32B 27/34 (2006.01); B32B 15/088 (2006.01); B32B 27/28 (2006.01); B32B 15/095 (2006.01); B32B 15/14 (2006.01); B32B 15/082 (2006.01); B32B 15/04 (2006.01); B32B 5/26 (2006.01); B29C 55/08 (2006.01); B32B 3/08 (2006.01); B32B 15/08 (2006.01); B32B 37/20 (2006.01); B32B 38/18 (2006.01); B32B 15/06 (2006.01); B32B 25/14 (2006.01); B32B 27/36 (2006.01); B32B 27/08 (2006.01); B29K 21/00 (2006.01); B29L 9/00 (2006.01); B29L 31/48 (2006.01);
U.S. Cl.
CPC ...
A61F 13/15699 (2013.01); A61F 13/15593 (2013.01); A61F 13/15601 (2013.01); A61F 13/15609 (2013.01); A61F 13/15674 (2013.01); A61F 13/15723 (2013.01); A61F 13/15731 (2013.01); A61F 13/15739 (2013.01); A61F 13/15764 (2013.01); A61F 13/49009 (2013.01); A61F 13/49012 (2013.01); A61F 13/49019 (2013.01); B29C 55/02 (2013.01); B29C 65/08 (2013.01); B29C 65/74 (2013.01); B29C 66/00145 (2013.01); B29C 66/43 (2013.01); B29C 66/4722 (2013.01); B29C 66/83413 (2013.01); B32B 5/022 (2013.01); B32B 7/05 (2019.01); B32B 27/12 (2013.01); B32B 37/1018 (2013.01); B32B 37/14 (2013.01); B32B 38/0012 (2013.01); A61F 2013/15715 (2013.01); A61F 2013/15869 (2013.01); A61F 2013/15926 (2013.01); A61F 2013/49093 (2013.01); B29C 55/08 (2013.01); B29C 65/086 (2013.01); B29C 65/7847 (2013.01); B29C 66/1122 (2013.01); B29C 66/21 (2013.01); B29C 66/344 (2013.01); B29C 66/433 (2013.01); B29C 66/723 (2013.01); B29C 66/7294 (2013.01); B29C 66/81469 (2013.01); B29C 66/83411 (2013.01); B29C 66/83415 (2013.01); B29K 2021/003 (2013.01); B29K 2995/0046 (2013.01); B29L 2009/00 (2013.01); B29L 2031/4878 (2013.01); B32B 3/08 (2013.01); B32B 5/22 (2013.01); B32B 5/26 (2013.01); B32B 7/04 (2013.01); B32B 15/04 (2013.01); B32B 15/043 (2013.01); B32B 15/06 (2013.01); B32B 15/08 (2013.01); B32B 15/082 (2013.01); B32B 15/088 (2013.01); B32B 15/09 (2013.01); B32B 15/095 (2013.01); B32B 15/14 (2013.01); B32B 25/14 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/285 (2013.01); B32B 27/302 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 27/40 (2013.01); B32B 37/144 (2013.01); B32B 37/20 (2013.01); B32B 38/1858 (2013.01); B32B 2038/0028 (2013.01); B32B 2262/0207 (2013.01); B32B 2262/14 (2013.01); B32B 2270/00 (2013.01); B32B 2274/00 (2013.01); B32B 2307/51 (2013.01); B32B 2307/718 (2013.01); B32B 2307/732 (2013.01); B32B 2555/02 (2013.01); B32B 2556/00 (2013.01);
Abstract

The methods herein relate to assembling an elastic laminate with a first elastic material and a second elastic material bonded between first and second substrates. During assembly, an elastic laminate may be formed by positioning the first and second substrates in contact with stretched central regions of the first and second elastic materials. The elastic laminates may include two or more bonding regions that may be defined by the various layers or components of the elastic laminate that are laminated or stacked relative to each other. In some configurations, a first plurality of ultrasonic bonds are applied to the elastic laminate to define a first bond density in the first bonding region, and a second plurality of ultrasonic bonds are applied to the elastic laminate to define a second bond density in the second bonding region, wherein the second bond density is not equal to the first bond density.


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