The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Dec. 28, 2018
Applicant:

Nitto Denko Corporation, Ibaraki, JP;

Inventors:

Kazuto Yamagata, Osaka, JP;

Hironobu Machinaga, Osaka, JP;

Hiroichi Ukei, Osaka, JP;

Takehiro Ui, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 9/00 (2006.01); H01Q 17/00 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0088 (2013.01); H01Q 17/008 (2013.01);
Abstract

An electromagnetic wave absorber () includes a resistive layer (), an electrically conductive layer () and a dielectric layer (). The electrically conductive layer () has a sheet resistance lower than a sheet resistance of the resistive layer (). The dielectric layer () is disposed between the resistive layer () and the electrically conductive layer (). The electromagnetic wave absorber () has a first slit (). The first slit () extends, in the resistive layer (), from a first principal surface () distal to the dielectric layer () toward the dielectric layer () in a direction perpendicular to the first principal surface () and divides the resistive layer () into a plurality of first blocks (). Each of the first blocks () has a minimum dimension (D) of 2 mm or more at the first principal surface ().


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