The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Mar. 11, 2020
Applicant:

Bull Sas, Les Clayes-sous-Bois, FR;

Inventors:

Luc Dallaserra, Paris, FR;

Marc Raeth, Tacoignieres, FR;

Assignee:

Bull SAS, Les Clayes-sous-Bois, FR;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20809 (2013.01); G06F 1/20 (2013.01); H05K 7/2039 (2013.01); H05K 7/20327 (2013.01); H05K 7/20336 (2013.01); G06F 2200/201 (2013.01);
Abstract

A heatsink for a plurality of memory modules that can be connected to an electronic board, each memory module including two heat exchange surfaces, includes at least one envelope including a top surface, at least two outer tabs, configured to be in thermal contact with at least one heat exchange surface of at least one memory module, at least one contact surface, in thermal contact with the fluid cooling system of said electronic board, a plurality of inner tabs, each inner tab being interposed between two memory modules in order to make thermal contact with at least one exchange surface of each of the two memory modules, the envelope is detachably placed against the two exchange surfaces of each memory module, the envelope is mechanically detachably fastened to the board.


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