The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2022
Filed:
Dec. 04, 2018
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Shunsuke Sasaki, Tokyo, JP;
Yusuke Morimoto, Tokyo, JP;
Assignee:
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/14 (2006.01); H05K 1/11 (2006.01); H05K 3/34 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 1/141 (2013.01); H05K 1/111 (2013.01); H05K 3/34 (2013.01); H05K 3/366 (2013.01); H05K 2201/0302 (2013.01);
Abstract
A printed wiring board includes a main substrate, a standing substrate, a first electrode portion, and a second electrode portion. The second electrode portion is connected to the first electrode portion with solder while a support portion is inserted in a slit. The first electrode portion is provided to reach the slit. The second electrode portion is disposed to span from a bottom surface to a height position higher than or equal to a midpoint between a top surface and the bottom surface.