The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Apr. 26, 2019
Applicants:

Autonetworks Technologies, Ltd., Yokkaichi, JP;

Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventor:

Shun Takamizawa, Yokkaichi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0209 (2013.01); H05K 2201/066 (2013.01);
Abstract

A circuit deviceincludes: a circuit assembly including a circuit board; a heat sink; and heat dissipation grease. The heat sink includes a main plate portion disposed to face the circuit board, and boss portions protruding from the main plate portion toward the circuit board and abutting the circuit board, and is a member fixed to the circuit board by screwing. The heat dissipation grease is a heat transfer material that is interposed between the circuit board and the main plate portion, and has fluidity. The main plate portion includes, on a heat transfer surface facing the circuit board, a first grease application region to which the heat dissipation grease is applied. The circuit board includes a shielding wall extending from a heat dissipation surface facing the main plate portion toward an intermediate region between the first boss portion and the first grease application region in the main plate portion.


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