The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Dec. 19, 2019
Applicant:

Taiyo Yuden Co., Ltd., Tokyo, JP;

Inventors:

Hideyuki Sekine, Tokyo, JP;

Hosung Choo, Tokyo, JP;

Makoto Inoue, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/05 (2006.01); H05K 1/16 (2006.01); H05K 1/11 (2006.01); H03H 9/64 (2006.01); H05K 1/02 (2006.01); H03H 9/72 (2006.01); H03H 3/08 (2006.01); H05K 3/34 (2006.01); H05K 3/40 (2006.01); H05K 3/36 (2006.01); H03H 9/02 (2006.01); H03H 9/145 (2006.01); H01L 41/047 (2006.01);
U.S. Cl.
CPC ...
H03H 9/059 (2013.01); H03H 3/08 (2013.01); H03H 9/6406 (2013.01); H03H 9/72 (2013.01); H05K 1/0243 (2013.01); H05K 1/0266 (2013.01); H05K 1/111 (2013.01); H05K 1/162 (2013.01); H05K 1/165 (2013.01); H05K 3/341 (2013.01); H05K 3/368 (2013.01); H05K 3/4007 (2013.01); H01L 41/0477 (2013.01); H03H 9/02637 (2013.01); H03H 9/02834 (2013.01); H03H 9/14541 (2013.01); H03H 9/14544 (2013.01); H05K 2201/09936 (2013.01);
Abstract

A high-frequency device includes: a circuit substrate including dielectric layers that are stacked, wiring patterns located on at least one of the dielectric layers, and a passive element formed of at least one of the wiring patterns, the circuit substrate having a first surface that is a surface of an outermost dielectric layer in a stacking direction of the dielectric layers; a terminal for connecting the high-frequency device to an external circuit, the terminal being located on the first surface and electrically connected to the passive element through a first path in the circuit substrate; and an acoustic wave element located on the first surface and electrically connected to the passive element through a second path in the circuit substrate.


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