The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2022
Filed:
Dec. 27, 2018
Applicant:
Lapis Semiconductor Co., Ltd, Kanagawa, JP;
Inventor:
Koji Morita, Kanagawa, JP;
Assignee:
LAPIS SEMICONDUCTOR CO., LTD., Yokohama, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02J 50/12 (2016.01); H02J 50/80 (2016.01); H02J 7/02 (2016.01); H04W 4/80 (2018.01);
U.S. Cl.
CPC ...
H02J 50/12 (2016.02); H02J 7/025 (2013.01); H02J 50/80 (2016.02); H04W 4/80 (2018.02);
Abstract
A semiconductor device formed in a single semiconductor integrated circuit, the semiconductor device including: a transmission signal circuit block; a reception signal circuit block; a signal processing circuit block; and at least one of a charging control circuit block or a monitoring circuit block.
Quick Actions:
Morita, Koji. (2022). Semiconductor device and semiconductor module (U.S. Patent No. 11264838). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11264838
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