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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11264834 B1

PDFFull Text
Date of Patent:
Mar. 01, 2022

Filed:

Feb. 13, 2017

Coil apparatus

Applicant:

Ihi Corporation, Tokyo, JP;

Inventors:

Kentaro Furiya, Tokyo, JP;

Kenji Nishimura, Tokyo, JP;

Assignee:

IHI CORPORATION, Tokyo, JP;

Attorney:

Volpe Koenig

Primary Examiner:

Shawki S Ismail

Assistant Examiner:

Kazi S Hossain

Int. Cl.
CPC ...
H01F 27/02 (2006.01); H02J 50/00 (2016.01); H02J 50/70 (2016.01); H01F 27/28 (2006.01); H02J 50/12 (2016.01); H01F 27/255 (2006.01); B60L 53/30 (2019.01); H01F 27/04 (2006.01); H02J 7/02 (2016.01); H01F 38/14 (2006.01); B60L 53/122 (2019.01); B60L 53/126 (2019.01); H01F 27/06 (2006.01); H01F 27/24 (2006.01); H01F 27/34 (2006.01);
U.S. Cl.
CPC ...
H02J 50/005 (2020.01); B60L 53/122 (2019.02); B60L 53/126 (2019.02); B60L 53/30 (2019.02); H01F 27/04 (2013.01); H01F 27/06 (2013.01); H01F 27/24 (2013.01); H01F 27/255 (2013.01); H01F 27/2823 (2013.01); H01F 27/2871 (2013.01); H01F 27/34 (2013.01); H01F 38/14 (2013.01); H02J 7/025 (2013.01); H02J 50/12 (2016.02); H02J 50/70 (2016.02); H01F 2027/348 (2013.01);
Abstract

A coil apparatus includes a base having a front surface and a rear surface, a magnetic portion provided on a side of the front surface of the base, and a coil portion which is provided on an opposite side from the base with respect to the magnetic portion and includes a conductive wire. The magnetic portion includes a first passing region, the base includes a second passing region, and the conductive wire is drawn out from the rear surface of the base through the first passing region and the second passing region.

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Furiya, Kentaro. (2022). Coil apparatus (U.S. Patent No. 11264834). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11264834

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