The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2022
Filed:
Jan. 03, 2019
Applicant:
Oepic Semiconductors, Inc., Sunnyvale, CA (US);
Inventor:
Yi-Ching Pao, Sunnyvale, CA (US);
Assignee:
OEPIC SEMICONDUCTORS, INC., Sunnyvale, CA (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/0234 (2021.01); H01S 5/042 (2006.01); H01S 5/42 (2006.01); H01S 5/323 (2006.01); H01S 5/024 (2006.01); H01S 5/183 (2006.01); H01S 5/0237 (2021.01); H01S 5/026 (2006.01); H01S 5/02345 (2021.01);
U.S. Cl.
CPC ...
H01S 5/04254 (2019.08); H01S 5/0234 (2021.01); H01S 5/0237 (2021.01); H01S 5/02469 (2013.01); H01S 5/18305 (2013.01); H01S 5/18344 (2013.01); H01S 5/323 (2013.01); H01S 5/423 (2013.01); H01S 5/026 (2013.01); H01S 5/02345 (2021.01); H01S 5/04257 (2019.08);
Abstract
A flip chip backside Vertical Cavity Surface Emitting Laser (VCSEL) package has a VCSEL pillar array. A first metal contact is formed over a top section of each pillar of the VCSEL pillar array. A second metal contact is formed on a back surface of the VCEL pillar array. An opening is formed in the second metal contact and aligned with the pillars of the VCSEL pillar array. Solder tip is applied on each pillar of the VCSEL pillar array to flip chip mount the VCSEL pillar array.