The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Jun. 02, 2020
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Shin Haeng Heo, Suwon-si, KR;

Young Sik Hur, Suwon-si, KR;

Hak Gu Kim, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01Q 9/04 (2006.01); H01Q 1/22 (2006.01); H01Q 1/38 (2006.01); H01Q 21/28 (2006.01);
U.S. Cl.
CPC ...
H01Q 9/0407 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/38 (2013.01); H01Q 21/28 (2013.01);
Abstract

A radio frequency module includes an interposer having a stack structure in which at least one insulating layer and at least one wiring layer are alternately stacked; a radio frequency IC disposed on a first surface of the interposer; a front-end IC disposed on a second surface of the interposer opposite to the first surface; and electrical connection structures arranged to surround the front-end IC and having at least a portion electrically connected to the least one wiring layer. The radio frequency IC inputs or outputs a base signal and a first radio frequency signal having a frequency higher than a frequency of the base signal through the at least one wiring layer, and the front-end IC inputs or outputs the first radio frequency signal and a second radio frequency signal having power different from power of the first radio frequency signal.


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