The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Mar. 06, 2020
Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Naoki Ishida, Anan, JP;

Takuya Yamanoi, Tokushima, JP;

Hirofumi Yoshida, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/44 (2010.01); H01L 33/32 (2010.01); H01L 33/00 (2010.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 33/50 (2010.01);
U.S. Cl.
CPC ...
H01L 33/44 (2013.01); H01L 33/0075 (2013.01); H01L 33/32 (2013.01); H01L 33/486 (2013.01); H01L 33/507 (2013.01); H01L 33/62 (2013.01); H01L 2933/0025 (2013.01);
Abstract

A light emitting device includes a package having an upper surface and an upward-opening recess defined in a portion of the upper surface, at least one light-emitting element in the recess, a light-transmissive member covering the opening of the recess, and an antireflection film on a lower surface of the light-transmissive member, the antireflection film located between the lower surface of the light-transmissive member and an upper surface of the package at a location where a portion of the lower surface of the light-transmissive member is bonded to the upper surface of the package via the antireflection film. A coating film is disposed on at least a portion of an outer surfaces of the light emitting device, the portion including a region where the antireflection film located between the lower surface of the light-transmissive member and the upper surface of the package is exposed.


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