The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2022
Filed:
May. 19, 2017
Shindengen Electric Manufacturing Co., Ltd., Tokyo, JP;
Kosuke Ikeda, Hanno, JP;
Osamu Matsuzaki, Hanno, JP;
SHINDENGEN ELECTRIC MANUFACTURING CO., LTD., Tokyo, JP;
Abstract
A method of manufacturing a chip module comprises a step of disposing a first electronic elementon a first jig, a step of disposing a first connectoron the first electronic elementvia a conductive adhesive, a step of disposing a second electronic elementon the first connectorvia a conductive adhesive, a step of disposing a second connectoron a second jig, a step of reversing the second jig in a state where the second connectoris fixed to the second jigand disposing the second connectoron the second electronic elementvia a conductive adhesive, and a step of curing the conductive adhesives