The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2022
Filed:
Apr. 02, 2020
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Shinya Nakagawa, Fukuoka, JP;
Takuya Shiraishi, Fukuoka, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/373 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 25/00 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 21/4882 (2013.01); H01L 21/565 (2013.01); H01L 24/48 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H01L 23/49575 (2013.01); H01L 24/05 (2013.01); H01L 2224/48132 (2013.01);
Abstract
A power semiconductor device includes a frame, a semiconductor element, a substrate, and a sealing resin. The semiconductor element is disposed on the frame. The substrate is disposed on a side of the frame opposite to a side on which the semiconductor element is disposed. The sealing resin seals the semiconductor element and the substrate. The substrate includes a metal sheet, a first insulating sheet on one main surface side of the metal sheet, and a second insulating sheet on the other main surface side of the metal sheet. The metal sheet has flexibility at a normal temperature.