The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

May. 18, 2018
Applicant:

Kyocera Corporation, Kyoto, JP;

Inventor:

Makoto Yamamoto, Kirishima, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/08 (2006.01); H01L 23/498 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H01L 23/08 (2013.01); H01L 23/49822 (2013.01); H05K 1/03 (2013.01);
Abstract

A wiring board includes an insulating substrate and a wiring conductor. The insulating substrate includes a first layer having an upper surface and a lower surface and having a first content of aluminum oxide and containing mullite and a second layer stacked on the upper surface and/or the lower surface of the first layer and having a second content of aluminum oxide greater than the first content. The wiring conductor is located inside the first layer and contains a manganese compound and/or a molybdenum compound. A manganese silicate phase and/or a magnesium silicate phase in an interface area between the insulating substrate and the wiring conductor.


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Yamamoto, Makoto. (2022). Wiring board, electronic device package, and electronic device (U.S. Patent No. 11264293). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11264293

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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