The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Dec. 12, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Asaf Schlezinger, Modi'in, IL;

Markus J. Stopper, Voerstetten, DE;

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); H01L 21/687 (2006.01); H01L 21/67 (2006.01); H01L 21/66 (2006.01); H01L 21/677 (2006.01); G01R 31/26 (2020.01);
U.S. Cl.
CPC ...
H01L 21/68707 (2013.01); G01R 31/2601 (2013.01); G01R 31/2834 (2013.01); H01L 21/6776 (2013.01); H01L 21/67271 (2013.01); H01L 21/67288 (2013.01); H01L 21/67742 (2013.01); H01L 22/26 (2013.01);
Abstract

A substrate rotator configured to rotate one or more substrates includes a body, a body actuator coupled to the body and configured to rotate the body, and a first and second gripper coupled to the body. A substrate edge metrology system that measures side chips or other defects on all sides of the substrate is also described. The metrology system includes two metrology stations and the substrate rotator. Methods for measuring side chips or other defects on a substrate are also provided. The method includes performing metrology on a first set of sides of the first substrate, rotating the first substrate by a first angle, and performing metrology on the second set of sides of the first substrate.


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