The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Dec. 14, 2018
Applicant:

Asahi FR R&d Co., Ltd., Saitama, JP;

Inventors:

Shinji Takeoka, Tokyo, JP;

Toshinori Fujie, Tokyo, JP;

Kento Yamagishi, Tokyo, JP;

Hiroshi Takami, Saitama, JP;

Masaru Azuma, Saitama, JP;

Syo Mihara, Saitama, JP;

Assignee:

ASAHI FR R&D CO., LTD., Saitama, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/00 (2006.01); H01B 7/06 (2006.01); H01B 7/04 (2006.01); H01B 7/42 (2006.01);
U.S. Cl.
CPC ...
H01B 7/06 (2013.01); H01B 7/04 (2013.01); H01B 7/421 (2013.01);
Abstract

An extensible electroconductive wiring material includes a flexible electroconductive material and insulating elastic bodies and, wherein the flexible electroconductive material having an electroconductive layer has vent peripheral edge portions in which vent holes and/or vent slits are penetrated and aligned in series and/or in parallel along an energization direction of the electroconductive layer while the vent peripheral edge portions are energizably linked, and the vent peripheral edge portions is sealed and covered by the insulating elastic bodies, so as not to be exposed; and the insulating elastic bodies, have penetration slits, and/or penetration holes which penetrate therethrough while matching the vent peripheral edge portions and are smaller than the vent holes and the vent slits. The extensible electroconductive wiring module has a plurality of these extensible electroconductive wiring materials.


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