The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Dec. 30, 2019
Applicant:

Xiamen Tianma Micro-electronics Co., Ltd., Xiamen, CN;

Inventors:

Ankai Ling, Xiamen, CN;

Poping Shen, Xiamen, CN;

Xiuzhen Xie, Xiamen, CN;

Lihua Zheng, Xiamen, CN;

Xuexin Lan, Xiamen, CN;

Lu Zhou, Xiamen, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2006.01); H01L 27/146 (2006.01); G06F 3/042 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
G06K 9/0004 (2013.01); G06F 3/0421 (2013.01); H01L 27/1461 (2013.01); H01L 27/14623 (2013.01); H01L 27/14678 (2013.01); H01L 27/323 (2013.01); H01L 27/3234 (2013.01); H01L 27/3272 (2013.01);
Abstract

Provided are an array substrate and display device. The array substrate includes a base substrate; a fingerprint recognition unit with a light sensing structure; a light blocking layer and an electrode connecting structure arranged at a side of the light sensing structure facing away from the base substrate. The light blocking layer is provided with a collimation hole. A vertical projection of the collimation hole on the base substrate is partially overlapped with a vertical projection of the light sensing structure on the base substrate. An insulation layer is arranged between the electrode connecting structure and the light sensing structure. The insulation layer is provided with an electrode via. The electrode connecting structure is connected to the light sensing structure through the electrode via. The vertical projection of the collimation hole on the base substrate is not overlapped with a vertical projection of the electrode via on the base substrate.


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