The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Sep. 08, 2020
Applicant:

Htc Corporation, Taoyuan, TW;

Inventors:

Chih-Yao Kuo, Taoyuan, TW;

Chin-Kai Sun, Taoyuan, TW;

Chung-Chiao Tan, Taoyuan, TW;

Tung-Hsin Yeh, Taoyuan, TW;

Assignee:

HTC Corporation, Taoyuan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); H05K 7/20 (2006.01); H01L 23/467 (2006.01);
U.S. Cl.
CPC ...
G06F 1/203 (2013.01); H01L 23/467 (2013.01); H05K 7/20172 (2013.01);
Abstract

An electronic device includes a casing, a motherboard, a battery, a fan, and a heat dissipation module. The motherboard is arranged in the casing, and defines a first space with the casing. The battery is arranged in the casing and defines a second space with the motherboard. The motherboard separates the first space and the second space. The fan is arranged in the casing and has a first airflow outlet and a second airflow outlet independent of the first airflow outlet. The first airflow outlet communicates with the first space and the second space. The heat dissipation module is arranged in the casing and transfers heat from the motherboard to the second airflow outlet.


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