The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

May. 12, 2016
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Sergio Gonzalez, Sant Cugat del Valles, ES;

Jordi Sanroma, Sant Cugat del Valles, ES;

Jordi Gonzalez, Sant Cugat del Valles, ES;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G05B 19/4099 (2006.01); B33Y 50/00 (2015.01); B29C 64/386 (2017.01);
U.S. Cl.
CPC ...
G05B 19/4099 (2013.01); B29C 64/386 (2017.08); B33Y 50/00 (2014.12); G05B 2219/49023 (2013.01);
Abstract

A method is described in which a 3MF (3D Manufacturing Format) file is adapted for use with a three-dimensional (3D) printing system. The 3MF file includes at least one 3D model having polygonal slices. The method comprises parsing the 3MF file, generating an intermediate file for the 3D model included in the 3MF file, and performing a polygon cleanup for the polygonal slices of the 3D model of the intermediate file. The polygon cleanup is performed using an implementation of a polygon clipping algorithm. Further, the method comprises generating a resulting file for the intermediate file comprising the polygonal slices for which the polygon cleanup has been performed.


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