The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Jul. 31, 2020
Applicant:

Rockley Photonics Limited, Oxford, GB;

Inventors:

Gerald Cois Byrd, Shadow Hills, CA (US);

Chia-Te Chou, Pasadena, CA (US);

Karlheinz Muth, Richardson, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); G02B 6/42 (2006.01); H01L 25/16 (2006.01); H04B 10/25 (2013.01); H04B 10/40 (2013.01);
U.S. Cl.
CPC ...
G02B 6/12004 (2013.01); G02B 6/12002 (2013.01); G02B 6/426 (2013.01); G02B 6/4246 (2013.01); G02B 6/4257 (2013.01); G02B 6/4263 (2013.01); G02B 6/4266 (2013.01); G02B 6/4272 (2013.01); G02B 6/4274 (2013.01); G02B 6/4281 (2013.01); H01L 25/167 (2013.01); H04B 10/25 (2013.01); H04B 10/40 (2013.01); G02B 6/4249 (2013.01); G02B 6/4271 (2013.01);
Abstract

An optoelectronic module. In some embodiments, the module includes: a housing, a substantially planar subcarrier, a photonic integrated circuit, and an analog electronic integrated circuit. The subcarrier has a thermal conductivity greater than 10 W/m/K. The photonic integrated circuit and the analog electronic integrated circuit are secured to a first side of the subcarrier, and the subcarrier is secured to a first wall of the housing. A second side of the subcarrier, opposite the first side of the subcarrier, is parallel to, secured to, and in thermal contact with, an interior side of the first wall of the housing.


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