The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Jul. 19, 2018
Applicants:

Industrial Technology Research Institute, Hsinchu, TW;

Intellectual Property Innovation Corporation, Hsinchu, TW;

Inventors:

Jui-Chang Chuang, Kaohsiung, TW;

Chen-Chu Tsai, Taichung, TW;

Kai-Ming Chang, New Taipei, TW;

Chih-Chia Chang, Hsinchu County, TW;

Ting-Hsun Cheng, Chiayi County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 1/14 (2015.01); B32B 7/12 (2006.01);
U.S. Cl.
CPC ...
G02B 1/14 (2015.01); B32B 7/12 (2013.01); B32B 2307/558 (2013.01); B32B 2307/584 (2013.01); B32B 2457/00 (2013.01);
Abstract

An impact resistant structure adapted to an electronic component. The impact resistant structure includes a resistance stack layer and a damping laminate. The resistance stack layer is disposed on a first surface of the electronic component, and the damping laminate is disposed on a second surface of the electronic component. The second surface of the electronic component is opposite to the first surface. The damping laminate includes a soft film and a support film, where the support film is disposed between the soft film and the electronic component.


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