The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Nov. 19, 2018
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventors:

Tetsuya Otsuki, Fujimi, JP;

Masataka Kazuno, Kofu, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01P 1/02 (2006.01); G05D 1/08 (2006.01); B60W 30/02 (2012.01); G01C 19/5783 (2012.01); G01P 15/18 (2013.01);
U.S. Cl.
CPC ...
G01P 1/023 (2013.01); B60W 30/02 (2013.01); G01C 19/5783 (2013.01); G01P 15/18 (2013.01); G05D 1/0891 (2013.01); B60W 2420/905 (2013.01); B60W 2710/18 (2013.01); B60W 2710/22 (2013.01); G05D 2201/0213 (2013.01); H01L 2924/00 (2013.01);
Abstract

A sensor unit includes a plurality of terminal members each of which includes a lead portion and an external terminal portion having an external connection end face, a sensor device connected to the lead portions, and a resin member that covers the sensor device and a part of the plurality of terminal members. The lead portion includes a thin wall portion having a thickness thinner than the external terminal portion and a protruding portion protruding from the thin wall portion to an external connection end face side. In a plan view from a direction where the terminal member and the sensor device overlap, the sensor device is disposed at a position overlapping the protruding portion and not overlapping the external terminal portion.


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