The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Aug. 03, 2017
Applicants:

Mitsubishi Electric Corporation, Tokyo, JP;

The University of Tokyo, Tokyo, JP;

Inventors:

Tsuyoshi Maeda, Tokyo, JP;

Shinya Higashiiue, Tokyo, JP;

Akira Ishibashi, Tokyo, JP;

Ryuichi Nagata, Tokyo, JP;

Eiji Hihara, Tokyo, JP;

Chaobin Dang, Tokyo, JP;

Jiyang Li, Tokyo, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F28D 1/053 (2006.01); F28F 1/02 (2006.01); F25B 39/02 (2006.01); F28D 21/00 (2006.01); F28F 9/02 (2006.01);
U.S. Cl.
CPC ...
F28D 1/053 (2013.01); F28F 1/022 (2013.01); F25B 39/02 (2013.01); F28D 2021/0068 (2013.01); F28D 2021/0084 (2013.01); F28F 9/02 (2013.01); F28F 2215/12 (2013.01);
Abstract

In a heat exchanger, each of a plurality of heat exchange members includes: a main body portion including a heat transfer pipe; and extending portions provided to the main body. The extending portions extend from ends of the main body portion in a third direction. When a dimension of the main body portion in the third direction is represented by La, a dimension of the extending portions in the third direction is represented by Lf, a dimension of a wall thickness of each of the heat transfer pipes is represented by tp, and a thickness dimension of each of the extending portions is represented by Tf, relationships: Lf/La≥1 and Tf≤tp are satisfied.


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