The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Oct. 28, 2019
Applicants:

Daicel Corporation, Osaka, JP;

Tohoku University, Sendai, JP;

Inventors:

Norihiro Kimoto, Tokyo, JP;

Tomohiro Goto, Tokyo, JP;

Koshi Adachi, Sendai, JP;

Tsubasa Takahashi, Sendai, JP;

Assignees:

DAICEL CORPORATION, Osaka, JP;

TOHOKU UNIVERSITY, Sendai, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/26 (2006.01); C23C 14/16 (2006.01); C23C 26/00 (2006.01); F16C 29/02 (2006.01); C23C 28/04 (2006.01); C23C 24/02 (2006.01); C23C 14/06 (2006.01); F16J 9/26 (2006.01); C01B 32/05 (2017.01); C23C 14/32 (2006.01); F16C 29/04 (2006.01); F16C 29/00 (2006.01); C01B 32/20 (2017.01); C01B 32/25 (2017.01); C10M 103/02 (2006.01);
U.S. Cl.
CPC ...
C23C 14/16 (2013.01); C01B 32/05 (2017.08); C23C 14/0605 (2013.01); C23C 14/0611 (2013.01); C23C 14/32 (2013.01); C23C 16/26 (2013.01); C23C 24/02 (2013.01); C23C 26/00 (2013.01); C23C 28/04 (2013.01); C23C 28/042 (2013.01); C23C 28/046 (2013.01); F16C 29/02 (2013.01); F16J 9/26 (2013.01); C01B 32/20 (2017.08); C01B 32/25 (2017.08); C01P 2004/00 (2013.01); C10M 103/02 (2013.01); C10M 2201/041 (2013.01); F16C 29/00 (2013.01); F16C 29/04 (2013.01); F16C 2206/02 (2013.01);
Abstract

A sliding member includes a carbon transfer layer and can superiorly effectively decrease friction and reduce wear. A method produces the sliding member. The sliding member includes a substrate and a carbon transfer layer. The carbon transfer layer is disposed on the surface of the substrate and includes both spbonded carbon and spbonded carbon. The carbon transfer layer preferably has a ratio sp/(sp+sp) of the spbonded carbon to the totality of the spbonded carbon and the spbonded carbon of 0.1 or more.


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