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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11261516 B1

PDFFull Text
Date of Patent:
Mar. 01, 2022

Filed:

Nov. 16, 2018

Methods and systems for coating a steel substrate

Applicant:

Public Joint Stock Company “severstal”, Cherepovets, RU;

Inventors:

Zachary M. Detweiler, Sunnyvale, CA (US);

Joseph E. McDermott, Sunnyvale, CA (US);

Adam G. Thomas, Sunnyvale, CA (US);

Daniel E. Bullard, Sunnyvale, CA (US);

Martin Janousek, Sunnyvale, CA (US);

Assignee:

PUBLIC JOINT STOCK COMPANY “SEVERSTAL”, Cherepovets, RU;

Attorney:

Notaro, Michalos & Zaccaria P.C.

Primary Examiner:

Xiaowei Su

Int. Cl.
CPC ...
C23C 10/26 (2006.01); C23C 10/20 (2006.01); C21D 1/26 (2006.01); C22C 38/02 (2006.01); C22C 38/04 (2006.01); C22C 38/12 (2006.01); C22C 38/14 (2006.01); C21D 9/46 (2006.01); C22C 38/24 (2006.01); C22C 38/28 (2006.01); C22C 38/00 (2006.01); C22C 38/06 (2006.01); C22C 38/26 (2006.01);
U.S. Cl.
CPC ...
C23C 10/26 (2013.01); C21D 1/26 (2013.01); C21D 9/46 (2013.01); C22C 38/001 (2013.01); C22C 38/004 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/06 (2013.01); C22C 38/12 (2013.01); C22C 38/14 (2013.01); C22C 38/24 (2013.01); C22C 38/26 (2013.01); C22C 38/28 (2013.01); C23C 10/20 (2013.01); C21D 2211/001 (2013.01); C21D 2211/005 (2013.01);
Abstract

The present disclosure provides systems and methods for depositing a metal layer adjacent to or on a substrate. Substrates may comprise, for example, one or more of iron, chromium, nickel, silicon, vanadium, titanium, boron, tungsten, aluminum, molybdenum, cobalt, manganese, zirconium, and niobium, oxides thereof, nitrides thereof, sulfides thereof, or any combination thereof. A substrate may be a steel substrate. A metal layer may be deposited via, for example, roll coating, vapor deposition, slurry deposition, or electrochemical deposition.

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