The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Dec. 01, 2017
Applicant:

Uacj Corporation, Tokyo, JP;

Inventors:

Tatsuya Ide, Tokyo, JP;

Tomohiro Shoji, Tokyo, JP;

Dai Yamamoto, Tokyo, JP;

Assignee:

UACJ CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); B23K 35/02 (2006.01); C22C 21/12 (2006.01); C22F 1/057 (2006.01);
U.S. Cl.
CPC ...
B23K 35/0238 (2013.01); B32B 15/016 (2013.01); C22C 21/12 (2013.01); C22F 1/057 (2013.01); Y10T 428/12764 (2015.01);
Abstract

An aluminum alloy includes: a core material made of an aluminum alloy including Si, Cu, and Mn, with the balance being Al and unavoidable impurities; a brazing material cladded onto one side surface of the core material, and made of an aluminum alloy including Si, with the balance being Al and unavoidable impurities; and a sacrificial anode material cladded onto the other side surface of the core material, and made of an aluminum alloy including Zn and Si, with the balance being Al and unavoidable impurities, wherein a total number density of single phase pure Si and a intermetallic compound existing in the sacrificial anode material and having a grain size of 0.1 μm or more and 1.0 μm or less is 1×10/mmor more and 1×10/mmor less.


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