The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2022
Filed:
Jun. 21, 2018
Applicant:
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Inventors:
Yoshitaka Shibuya, Ibaraki, JP;
Kenji Sato, Ibaraki, JP;
Assignee:
JX NIPPON MINING & METALS CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 1/02 (2006.01); B22F 1/00 (2022.01); B33Y 70/00 (2020.01); C23C 14/16 (2006.01); C23C 14/22 (2006.01); C23C 18/16 (2006.01); C23C 18/31 (2006.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
B22F 1/0011 (2013.01); B22F 1/025 (2013.01); B33Y 70/00 (2014.12); C23C 14/165 (2013.01); C23C 14/223 (2013.01); C23C 18/1637 (2013.01); C23C 18/31 (2013.01); B22F 2301/10 (2013.01); B22F 2304/10 (2013.01); B33Y 80/00 (2014.12); Y10T 428/12181 (2015.01);
Abstract
A metal powder in which a coating made of one or more types of elements selected from Gd, Ho, Lu, Mo, Nb, Os, Re, Ru, Tb, Tc, Th, Tm, U, V, W, Y, Zr, Cr, Rh, Hf, La, Ce, Pr, Nd, Pm, Sm and Ti is formed on a surface of a copper or copper alloy powder, wherein a thickness of the coating is 5 nm or more and 500 nm or less. A metal powder for metal additive manufacturing based on the laser method which can be efficiently melted with a laser while maintaining the high conductivity of copper or copper alloy, and a molded object produced by using such metal powder are provided.