The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Oct. 01, 2019
Applicant:

Verily Life Sciences Llc, South San Francisco, CA (US);

Inventors:

Brian Pepin, San Francisco, CA (US);

Shiv Sabesan, San Mateo, CA (US);

Bo Lu, Santa Clara, CA (US);

Assignee:

Verily Life Sciences LLC, South San Francisco, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61N 1/00 (2006.01); A61N 1/05 (2006.01); H01B 3/30 (2006.01); A61N 1/36 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
A61N 1/0551 (2013.01); A61N 1/056 (2013.01); A61N 1/0553 (2013.01); A61N 1/0556 (2013.01); H01B 3/306 (2013.01); H01B 3/307 (2013.01); A61N 1/0526 (2013.01); A61N 1/3606 (2013.01); H05K 1/0283 (2013.01); H05K 2201/09263 (2013.01);
Abstract

The present disclosure relates to implantable neuromodulation devices and methods of fabrication, and in particular to a thin-film electrode assemblies and methods of fabricating the thin-film electrode assembly to include a soft overmold. Particularly, aspects of the present invention are directed to a thin-film electrode assembly that includes an overmold and a supporting structure formed within a portion of the overmold. The overmold includes a first polymer and the supporting structure includes a second polymer, different from the first polymer. The thin-film electrode assembly also includes a wire formed within a portion of the supporting structure, and an electrode formed on a top surface of the supporting structure and in electrical contact with the wire.


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