The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 22, 2022

Filed:

Oct. 03, 2016
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Kuan-Ting Wu, Taipei, TW;

Kevin Voss, Houston, TX (US);

Ai-Tsung Li, Taipei, TW;

Wei Kuang Chu, Taipei, TW;

Wei-Chung Chen, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); H05K 5/02 (2006.01); B32B 3/26 (2006.01); B32B 7/14 (2006.01); G06F 1/16 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H05K 5/02 (2013.01); B32B 3/26 (2013.01); B32B 7/14 (2013.01); G06F 1/1656 (2013.01); H05K 5/0086 (2013.01); B32B 2255/20 (2013.01); B32B 2457/00 (2013.01);
Abstract

Example implementations relate to multilayer housings. In one example, multilayer housing can include a first continuous layer comprising copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof, a void layer on the first continuous layer, wherein the void layer comprises from (5) volume percent (vol. %) to (95) vol. % voids; and a second continuous layer on the void layer, wherein the second continuous layer comprises copper, plastic, graphene, aluminum, titanium, magnesium, or combinations thereof.


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