The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2022
Filed:
Dec. 22, 2017
Applicant:
Huawei Technologies Co., Ltd., Shenzhen, CN;
Inventors:
David Powney, Kista, SE;
Ilkka Saarinen, Helsinki, FI;
Mikko Kylkilahti, Helsinki, FI;
Lei Han, Dongguan, CN;
Assignee:
HUAWEI TECHNOLOGIES CO., LTD., Shenzhen, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 3/32 (2006.01); H05K 1/18 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H05K 3/323 (2013.01); H05K 1/189 (2013.01); H05K 3/361 (2013.01); H05K 2201/094 (2013.01); H05K 2201/09381 (2013.01);
Abstract
An apparatus includes a printed circuit board and a flexible printed circuit. A rigid structure component is on a first side of the printed circuit board. An interconnection interface is on a second side of the printed circuit board opposite to the rigid structure component and is configured to interconnect the flexible printed circuit and the printed circuit board. A conductive interconnection material is at the interconnection interface between the flexible printed circuit and the printed circuit board.