The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 22, 2022

Filed:

Mar. 06, 2020
Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;

Inventors:

Jun Oh Hwang, Suwon-si, KR;

Jae Ho Shin, Suwon-si, KR;

Yun Je Ji, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0278 (2013.01); H05K 1/189 (2013.01); H05K 3/0014 (2013.01); H05K 9/0024 (2013.01); H05K 2201/0195 (2013.01); H05K 2201/10128 (2013.01);
Abstract

A printed circuit board includes a first rigid region and a flexible region, connected to the first rigid region and adjacent thereto in a first direction. The first rigid region has a thickness greater than a thickness of the flexible region, and the flexible region has a plurality of curved portions.


Find Patent Forward Citations

Loading…