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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11259401 B1

PDFFull Text
Date of Patent:
Feb. 22, 2022

Filed:

May. 04, 2020

Resin multilayer substrate, electronic component, and mounting structure thereof

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventor:

Hiromasa Koyama, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Kyoto, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/06 (2006.01); H05K 3/10 (2006.01); H05K 3/18 (2006.01); H05K 3/20 (2006.01); H05K 3/22 (2006.01); H05K 3/26 (2006.01); H05K 3/28 (2006.01); H05K 3/32 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01); H05K 3/44 (2006.01); H05K 3/46 (2006.01); H01L 23/00 (2006.01); H01L 23/02 (2006.01); H01L 23/12 (2006.01); H01L 23/14 (2006.01); H01L 23/48 (2006.01); H01L 23/50 (2006.01); H01L 23/66 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01R 12/57 (2011.01);
U.S. Cl.
CPC ...
H05K 1/0225 (2013.01); H05K 1/0219 (2013.01); H01R 12/57 (2013.01); H05K 2201/0723 (2013.01); H05K 2201/096 (2013.01); H05K 2201/0969 (2013.01); H05K 2201/0979 (2013.01); H05K 2201/09354 (2013.01); H05K 2201/09609 (2013.01);
Abstract

A resin multilayer substrate includes a plurality of insulating resin base material layers and a plurality of conductor patterns provided on the plurality of insulating resin base material layers. The plurality of conductor patterns include a signal line and a ground conductor overlapping the signal line as viewed from a laminating direction of the insulating resin base material layers. A plurality of openings are provided in the ground conductor, and an aperture ratio is higher in a zone far from the signal line than in a zone adjacent to or in a vicinity of the signal line in a direction perpendicular or substantially perpendicular to the laminating direction.

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