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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11259398 B1

PDFFull Text
Date of Patent:
Feb. 22, 2022

Filed:

Mar. 30, 2018

Electrical circuit board with low thermal conductivity and method of constructing thereof

Applicants:

Magna Seating Inc, Aurora, CA;

Eric Kozlowski, Oakland Township, MI (US);

Jason Davis, Commerce Township, MI (US);

Larry Peters, Jr., Fowlerville, MI (US);

Inventors:

Eric Kozlowski, Oakland Township, MI (US);

Jason Davis, Commerce Township, MI (US);

Larry Peters, Jr., Fowlerville, MI (US);

Assignee:

Magna Seating Inc., Aurora, CA;

Attorney:

Miller Canfield

Primary Examiner:

Xiaoliang Chen

Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/30 (2006.01); H05K 3/38 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01); B32B 27/04 (2006.01); B32B 27/08 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01); B32B 27/38 (2006.01); B32B 37/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0201 (2013.01); H05K 1/038 (2013.01); H05K 1/09 (2013.01); H05K 2201/0116 (2013.01); H05K 2201/029 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/062 (2013.01);
Abstract

An electrical circuit board includes a first conductive layer and a second conductive layer. And an interlayer forming a thermal barrier is placed between the first conductive layer and the second conductive layer, wherein the thermal barrier reduces heat transfer between the first conductive layer and the second conductive layer.

Find Patent Forward Citations

Kozlowski, Eric. (2022). Electrical circuit board with low thermal conductivity and method of constructing thereof (U.S. Patent No. 11259398). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11259398

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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