The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2022
Filed:
Sep. 04, 2020
Applicant:
Molex, Llc, Lisle, IL (US);
Inventors:
Brandon Janowiak, Wheaton, IL (US);
Kent E. Regnier, Lombard, IL (US);
Jerry Kachlic, Glen Ellyn, IL (US);
Assignee:
Molex, LLC, Lisle, IL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 24/60 (2011.01); H01R 12/72 (2011.01); H01R 13/504 (2006.01); H01R 13/6594 (2011.01); H01R 13/629 (2006.01); H01R 13/639 (2006.01); H01R 13/6582 (2011.01); H01R 107/00 (2006.01);
U.S. Cl.
CPC ...
H01R 24/60 (2013.01); H01R 12/724 (2013.01); H01R 13/504 (2013.01); H01R 13/629 (2013.01); H01R 13/639 (2013.01); H01R 13/6582 (2013.01); H01R 13/6594 (2013.01); H01R 2107/00 (2013.01);
Abstract
A connector system includes a plug assembly that has a front connector mounted to a circuit board. The connecter has two wafers that each support a row of terminals and uses shims and pegs to precisely control the spatial relationship of the two wafers to the circuit board. The wafers need not be directly contacting the circuit board and the terminals can have tails that can be positioned slightly above the circuit board and connector to pads on the circuit board via solder connections. The connector system is optimized so as to enable support of 25 Gbps data rates.