The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2022
Filed:
Nov. 13, 2019
Applicant:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Inventors:
Yosuke Matsushita, Kyoto, JP;
Ryota Asai, Kyoto, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01P 5/18 (2006.01); H01F 27/29 (2006.01); H01F 41/04 (2006.01); H01P 11/00 (2006.01);
U.S. Cl.
CPC ...
H01P 5/184 (2013.01); H01F 27/2804 (2013.01); H01F 27/292 (2013.01); H01F 41/043 (2013.01); H01P 11/003 (2013.01); H01F 2027/2809 (2013.01);
Abstract
A multilayer electronic component includes an element body including a plurality of base layers stacked in a first direction, an inner conductor disposed in the element body, and a mounting terminal connected to the inner conductor. The multilayer electronic component has a mount surface positioned on a mounted side when the multilayer electronic component is mounted. The mount surface is disposed so as not to intersect an axis along the first direction. The mounting terminal is disposed on the mount surface and embedded from the mount surface into the element body.