The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2022
Filed:
Dec. 18, 2019
Lite-on Opto Technology (Changzhou) Co., Ltd., Jiangsu Province, CN;
Lite-on Technology Corporation, Taipei, TW;
Tien-Yu Lee, Taipei, TW;
Chih-Yuan Chen, New Taipei, TW;
Wei-Lun Tsai, New Taipei, TW;
Chien-Tung Huang, New Taipei, TW;
Wei-Hsun Hsu, Taoyuan, TW;
Wei-Chien Hung, Taipei, TW;
LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., Jiangsu Province, CN;
LITE-ON TECHNOLOGY CORPORATION, Taipei, TW;
Abstract
A chip-scale LED package structure includes a white light emitting unit for emitting a white light, a red flip-chip LED for emitting a red light, a green flip-chip LED for emitting a green light, a blue flip-chip LED for emitting a blue light, and an encapsulation layer. The encapsulation includes an encapsulation resin and a plurality of refractive particles distributed in the encapsulation resin. The encapsulation layer encapsulates the white light emitting unit, the red flip-chip LED, the green flip-chip LED, and the blue flip-chip LED. Moreover, electrodes of the white light emitting unit, electrodes of the red flip-chip LED, electrodes of the green flip-chip LED, and electrodes of the blue flip-chip LED are exposed from the encapsulation layer.