The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2022
Filed:
Nov. 01, 2018
Applicant:
The Regents of the University of California, Oakland, CA (US);
Inventors:
Boris Vaisband, Los Angeles, CA (US);
Subramanian S. Iyer, Los Angeles, CA (US);
Adeel A. Bajwa, Los Angeles, CA (US);
Assignee:
THE REGENTS OF THE UNIVERSITY OF CALIFORNIA, Oakland, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H01L 23/498 (2006.01); H01L 23/14 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 23/147 (2013.01); H01L 23/473 (2013.01); H01L 23/49811 (2013.01); H01L 23/49866 (2013.01);
Abstract
A silicon interconnect fabric includes: (1) a substrate having a front side and a back side; (2) a front side patterned metal layer on the front side of the substrate; (3) a back side patterned metal layer on the back side of the substrate; (4) multiple conductive vias extending through the substrate and connecting the front side patterned metal layer and the back side patterned metal layer; and (5) multiple conductive posts connected to the back side patterned metal layer.