The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 22, 2022

Filed:

Nov. 27, 2019
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Do-Hyun Kim, Suwon-si, KR;

Sunwon Kang, Suwon-si, KR;

Hogeon Song, Suwon-si, KR;

Kyung Suk Oh, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 21/18 (2006.01); H01L 21/304 (2006.01); H01L 21/66 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 22/20 (2013.01); H01L 21/187 (2013.01); H01L 21/3043 (2013.01); H01L 21/67282 (2013.01); H01L 23/544 (2013.01);
Abstract

An inspection system for a semiconductor package includes an inspection apparatus that includes a stage on which the semiconductor package is loaded, and a computer coupled to the inspection apparatus. The semiconductor package may include a first semiconductor chip and a second semiconductor chip on the first semiconductor chip, the computer may provide first identification information about the first semiconductor chip and second identification information about the second semiconductor chip, and the computer may control the inspection apparatus to selectively perform a package test process on one of the first and second semiconductor chips, the one of the first and second semiconductor chips being identified as a good chip based on the first identification information and the second identification information.


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